Stress measurement

Process control due to precise measurement

Ex-situ measuring system

SIG-500SP

The stress measuring device SIG-500SP was developed to determine mechanical stresses in thin layers. On reference substrates, which are installed uncomplicated, measurement is quick and easy. The system can be set up and used just about anywhere. In a coating laboratory, it is thus a helpful tool for determining mechanical stresses of your coatings as part of quality control or coating development.

  • L x W x H:  50cm x 25cm x 25cm
  • Substrate:
    • one-sided reflective (glass, Si, etc.)
    • > 20mm x 10mm   &    < 100mm x 100mm
  • Thickness: 0.1mm to 5mm 
  • Sample installation in a few seconds
  • Measuring value acquisition in a few seconds
  • Continuous measurements over hours and days
  • Archiving of the measurement data
  • Resolution:

Furnace extension

With the furnace extension for SIG-500SP, stresses in thin films can be measured at changing temperatures. When thermal expansion coefficients of substrate and layer differ, it leads to a thermally induced deformation of the sample. This deformation can be used to determine the modulus of elasticity and coefficient of expansion of thin film. 

  • Substrate max. 60mm x 60mm
  • Maximum temperature 300°C
  • Heating rate approx. 10K / min
  • Heating Output 200W

In-situ measuring system

SIG-2000SP

This system can measure mechanical stresses during coating processes in real-time. Even moving substrates (e.g. on rotating calottes) can be measured by using a high-speed detector. The system is mounted on the coating line and regularly scans the reference substrate through a window. The permanently changing curvature is thus recorded continuously.

  • L x W x H:  50cm x 25cm x 25cm
  • Substrate:
    • one-sided reflective (glass, Si, etc.)
    • > 20mm x 10mm   &    < 100mm x 100mm
  • Thickness: 0.1mm to 5mm 
  • Sample installation in a few seconds
  • Measuring value acquisition in a few seconds
  • Continuous measurements over hours and days
  • Archiving of the measurement data
  • Resolution: